Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

Synopsis

Derechos de autor:
2014 Springer

Book Details

Book Quality:
ISBN-13:
9783319023786
Publisher:
Springer International Publishing, Cham
Date of Addition:
Idioma:
English
Categorías:
Nonfiction, Technology,
Usage Restrictions:
This is a copyrighted book.